半導體封裝

更小、更好、更快、更便宜。再也沒有其他的四句話能夠更恰當地說明半導體包裝市場的狀況了。在客戶要求產品更小,然而更強、更便宜的無情壓力之下,半導體專家在包裝材料這方面必須不斷的絞盡腦汁、推陳出新。

這也就是為什麼漢高在科技方面必須不斷地保持領先,發展獨特的材料方案,以應付今日電子產品永無止境的要求。譬如,以我們的材料組合觀點而言,我們了解您並沒有多餘的時間和資源可用來測試各種材料的相容性。因此由漢高來承擔開發的責任,在此過程中不斷地摸索並開發出一套已經過測試、可靠、而且保證可相容的材料以應付錫焊作業中最嚴格的要求。藉著經過特別設計並且可互相配合的材料,廠商可以高產量低成本的方式生產包裝材料。

漢高Hysol®的半導體產品,包括包裝階段的底部填充劑(package level underfills)、封裝樹脂(mold compounds)、及貼片膠(die attach)都是世界有名的品牌,其性能、可靠性、及傑出的功能即使在製造狀況不斷變更的無鉛製造環境之下亦無人能出其右。想要交出您客戶所要求的更小、更好、更快、及更便宜的產品嗎?我們保證您可以得到您所想要的。

Camera Modules & Image Sensors
Image sensors that are integrated with control electronics that transfer optical signal into a digital signal are found in numerous applications, including handheld devices, audio, TV and gaming products, traditional DSC and SLR cameras, video camcorders, automobiles and medical systems, with handhelds driving the largest percentage of the growth. Incorporation of image sensors and all their complementary parts requires adhesive materials that cure quickly at low temperature, deliver precise position and bondline control and, in many cases, UV and transparency properties. Through the use of rheology control and filler technology, Henkel has designed unique adhesives to address emerging requirements of image sensor assembly.  

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DRAM
The quality of a memory module is directly related to its DRAM (Dynamic Random Access Memory) chips. Henkel recognizes the importance of this essential memory system in computers and workstations, and provides an array of products that improve the consistency and reliability of the DRAM assembly process.

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Memory
Flash memory forms the data storage of mobile phones, core of MP3 players and most semiconductor memory card formats available today. Demand for these non-volatile memory devices has grown rapidly due to the expansion of mobile handsets, MP3 players and memory cards.

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Optoelectronics
Optoelectronic applications enable all types of data transfer, allowing us to lead lives that are more convenient and information rich. The most effective, efficient and advanced method of data transmission, optoelectronics leverage fiber-optic cables and multiple-optic components to deliver large quantities of information quickly over long distances.  
The integrity of the transmission is highly dependent upon the reliability of the fiber-optic connections and the assembly of the accompanying components, such as repeaters, amplifiers and splitters. To ensure robust performance and long-term reliability, advanced capability optoelectronic materials are essential. Henkel’s broad range of LOCTITE®-brand adhesives allows optoelectronic specialists to choose the material that suits specific manufacturing requirements. With superb reliability, fast-cure capability via UV, visible light or thermal techniques, and excellent adhesion on a variety of opto-surfaces, Henkel’s suite of optoelectronic adhesives exceeds today’s market needs.

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Wirebond Packaging
Any integrated circuit that achieves die connectivity through the use of thin wires is known as a wirebond package. BGAs, QFNs, QFPs and SOICs all fall into this category and are found in computers, tablets, smartphones and automobiles. Driving the advancement of wirebond packaging is the need to put more functionality into increasingly smaller geometries, which requires a reduction of the die-to-substrate ratio and the ability to manage very thin dies to reduce package height. Within the automotive sector, where semiconductor use is increasing as vehicles incorporate more electronics, RoHS compliance and high-reliability requirements demand material innovation. Regardless of the wirebond-device application, Henkel’s die attach, solder, mold compound and thermal management materials are enabling packaging specialists to address current and future manufacturing requirements. 

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Dakar Series